Tools of the TREX series have been used
in leading Chip fabs, Si wafer manufacturers and test
laboratories since 1988 when the first tools were introduced.
They have become an important method for quickly and easily
measuring contamination levels on front or wafer backsides
at various key-processing steps. The systems are available
in several configurations to meet every wafer size, element,
environment and automation requirement.
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TREX
610 Series: |
This high performance tool is suitable
for the most demanding applications, including
process development, yield enhancement studies, tool qualification
and quality control for all design rules including sub
micron. The 610 will handle 100mm,125mm,150mm, 200mm wafers
automatically via open cassette. Sealed
tube, single and twin sources are available. |
 |
TREX
620 Series: |
This high performance tool is suited
for the most demanding in fab applications, including
process development, yield enhancement studies, tool qualification,
tool fingerprinting and quality control for all design
rules. The 620 handles 150mm and 200mm wafers automatically
via open cassette or SMIF. The TREX620 can be equipped with one, two, or three sealed sources. It provides high uptime with very low cost of ownership.
Complete SECS GEM compliant software is available to meet
fab integration needs. |
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TREX
630 Series: |
This high performance
tool is suited for the most demanding in fab or lab applications,
including process development, yield enhancement studies,
tool qualification, tool fingerprinting and quality control
for all design rules. The 630 handles 200mm and 300mm
wafers automatically via open cassette or FOUP. One,
two, three, or four sources may be selected to optimize all elemental
ranges.
Complete SECS GEM 300 compliant software is available
to meet fab automation and
integration requirements. |
|
TREX
630i Series: |
| The TREX 630i combine the strengths
of the TXRF with an advanced sample preparation technique
that consolidate the contamination from the entire wafer
for TXRF measurement. This integrated solution is perfect
for fab requirements to cut time-to-answer and limit the
number of samples going to the lab. |
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Rapid
Scan TXRF: |
| Rapid Scan TXRF is an innovative technique
to rapidly scan the full surface of the wafer with TXRF.
Using an advanced software system and a new high precision
stage Technos can now increase the throughput of the TREX
620 or 630 series by 10-30 times. |
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TVD
910: |
| The TVD 910 is an automated VPD wafer
preparation system. The tool is used in conjunction with
TXRF and or ICP MS. Contamination is collected from the
wafer surface and concentrated into a droplet which is
then analyzed by either or both TXRF or ICP MS for contamination
levels. The system provides a wide variety of scan and
collection programs to satisfy a wide variety of analytical
needs all of which are automated for ease of use. The
system may also be linked to a TXRF or ICP MS tool for
seamless data handling and tracking. |
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applications
