 |
Tools of the TREX series have been used in leading Chip
fabs, Si wafer manufacturers and test laboratories
since
1988 when the first tools were introduced. They have
become an important method for quickly and easily measuring
contamination
levels on front or wafer backsides at various key-processing
steps. The systems are available in several configurations
to meet every wafer size, element, environment and
automation
requirement.
|
 |
 |
Tools of the S-MAT series are used in leading Chip fabs
and toolmakers since 1996 when the first tools were introduced.
They have become an important method for quickly and easily
measuring thin film properties on 150mm through 300mm
wafers at various key processing steps. The systems are
available in several configurations to meet every film
measurement requirement. Thickness, density surface and
interface roughness. Low K films may be measured for thickness,
porosity and pore size distribution. Recently, the
Xenith 1200 series was introduced to
complement the S-MAT Series.
|
|
 |
| |
applications
