Rapid Scan TXRF is an innovative technique to rapidly scan the full surface of the wafer with TXRF. Using an advanced software system and a new high precision stage Technos can now increase the throughput of the TREX 620 or 630 series by 10-30 times.

A traditional 49 point map of a 300mm wafer will only yield 6% of the surface area as inspected. Rapid scan TXRF allows our users to measure hundreds of points in the same amount of time tradition direct TXRF once required. It is now possible to run this fully automated feature on up to 1000 points giving you 100% coverage of a 300mm wafer. Programmable coordinate systems allow the user to scan areas with a high probability of contamination such as tool fixturing point to closely monitor tool-to-tool contamination or tool fingerprinting.

Rapid Scan TXRF is a next generation solution for the next generation problems that exist today.