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Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring
Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring
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Home : Products : Thin Film Metrology : S-MAT 2300 Series

S-MAT 2300 Series - S-MAT | Thin Film Thickness Measurement | Secs Gem | Thin Film Technology | FOUP Wafer Mapping | X Ray Technology

Request More Info - S-MAT | Thin Film Thickness Measurement | Secs Gem | Thin Film Technology | FOUP Wafer Mapping | X Ray Technology

In-Fab System

 

The S-MAT 2300(Semiconductor Materials Analysis Tool) is a metrology tool designed to accurately measure thin films, without standards.S-MAT 2300 combines XRR(X-ray Reflectivity), XRF(X-ray Fluorescence)& XRD(X-ray Diffraction)techniques in a single tool, which is to address industry needs at 32, 45, 65 and 90 nm nodes. The S-MAT 2300 handles with ease and precision - single and multi layer stacks, high-k, low-k, ultra thin films, and ALD films, to 5.0 A

The SMAT 2300 offers advanced capabilities that meet thin film process control requirements. The parameters which can be measured by the S-MAT 2300 are layer thickness, density, composition, surface and interstitial roughness, phase identification and crystal orientation of films.

S-MAT 2300 Series

Applications include:
Absolute density & thickness measurement of PCM(Phase Change Memory)films.
Accurate composition analysis of NVM(non-volatile memory)films.
Process development and control of ultar thin ALD barier and seed layer stacks.
Rapid measurement of ECP and plated Cu for density and thickness of 90nm and beyond nodes.
Ideally suited for Pre and post CMP thickness analysis.
Process control of electroless Co passivation layers.
High-K films,including gradient layer characterization.
Pre and post plasma treated CVD TiN for thickness,density and roughness variation.
Phase Identification and Crystal Orientation of films such as NiSi,TiN,Cu,ZrO2,TaN etc.

The S-MAT 2300 is designed for use in either the fab or lab and possesses the ability to bring new thin film materials successfully from development to production. The system reflects and stimulates characteristic XA-rays and quantifies the X-ray intensity into film thickness. It is a bridge tool that can handle 200 and 300 mm wafers. Fab friendly software, full automation and low maintenance make this tool the choice for today's and tomorrow's metrology needs.
 

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S-MAT On-Product
Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring

Technos On-Product X-Ray Metrology

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March 23 - 25th 2009

Surface Preparation and Cleaning Conference
Austin , TX, USA

Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring
Contamination Monitoring: TREX 610 Series | TREX 620 Series | TREX 630 Series | TREX 630i Series | Rapid Scan | TVD 910  
S-MAT On-Product | S-MAT PV XRF
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