Tools of the S-MAT
series have been used in leading Chip fabs and toolmakers since 1996
when the first tools were introduced. They have become
an important method for quickly and easily measuring thin
film properties on 150mm through 300mm wafers at various
key processing steps. The systems are available in several
configurations to meet every film measurement requirement.
Thickness, density surface and interface roughness. Low
K films may be measured for thickness, porosity and pore
size distribution.
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S-MAT
2000 Series: |
| The S-MAT 2000 uses
an advanced x-ray reflectivity (XRR) module to measure
single layer and stacked films without a standard. This
tool is perfect for 200mm production. Easy to use software,
standard less measurement, repeatability of 0.1% and
wide range of application make the S-MAT 2000 an excellent
solution for 200mm leading and trailing edge fabs. |
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S-MAT 2300 Series: |
The S-MAT 2300 uses special x-ray technologies
to measure film thickness, density, surface and interface
roughness, on thin dielectric and metal films. Single
and multi layer stacks are all possible. The tool may
be equipped to measure low K films for thickness, porosity
and pore size distribution. Composition measurements are
also possible. The system provides rapid, nondestructive
measurements on 200mm and 300mm wafers. Open cassette
and or FOUP wafer handling options are available.
SECS GEM software is available for fab integration.
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S-MAT On-Product: |
The S-MAT 2300PM x-ray metrology tool meets the demanding requirements for sub-45nm node FEOL and BEOL metrology. The S-MAT 2300PM combines three x-ray techniques in one tool, high resolution X-ray reflectivity (XRR), fast dual X-ray fluorescence (XRF), and X-ray diffraction (XRD) to obtain thickness, density, roughness, composition, crystal orientation and phase identification of films. The system is equipped with unique on-product optics leading to high throughput, high resolution and the lowest background.
SECS GEM software is available for fab integration.
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XENITH 1200 Series: |
| The Xenith 1200 uses advanced x-ray technology to measure
thickness and composition on ultra-thin and thick films with unsurpassed results.
Single and multilayer stacks are all possible.
The system provides rapid and nondestructive measurements with a small measurement
spot and can be configured with open cassette, SMIF or FOUP loadports.
SECS GEM software is available for fab integration. |
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S-MAT PV XRF: |
The S-MAT PV XRF is designed for non-damage and non-contact thin film thickness and composition measurements in the photovoltaic industry. Its focus is to bring new thin film materials successfully from development to production. Specializing in CdTe, CIGS, and Mo thin films, it is fully suited for solar cell analysis. The system uses X- ray fluorescence to detect characteristic x-rays and quantify the X- ray intensity into film thickness and composition measurements. The S-MAT PV XRF can handle large substrates up to 730 mm by 920 mm in size. It is a fully automated, user friendly tool that can be your solution in PV thin film measurement.
Specialized for thin film thickness and composition measurements of CdTe and CIGS
- Quick mapping to increase sample throughput
- High intensity XRF
- Non-destructive and non-contact measurements
- Accommodating large sample sizes for whole glass substrates
- Small spot size for line scan
- Customizable for each customer's PV thickness measurement needs
SECS GEM software is available for fab integration.
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applications
