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Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring Technos International - Semiconductor Metrology, X-Ray Measurement Solutions, Semiconductor Industry Solutions, Wafer Contamination Monitoring
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Home : Products : Contamination Monitoring : TREX 630i Integrated TXRF Series

TREX 630i Integrated TXRF Series - TREX | Monitoring Wafer Contamination Monitors | Secs Gem | X Ray Fluorescence Analyzer | ICPMS Instruments

Request More Info - TREX | Monitoring Wafer Contamination Monitors | Secs Gem | X Ray Fluorescence Analyzer | ICPMS Instruments

TREX 630i Integrated TXRF SeriesThe TREX 630i is the latest offering in the TREX product line. This tool offers the reliability and precision of our standard TREX 630, with the added feature of an integrated sample preparation module. Using a tested production design the sample preparation module will chemically collect the contamination from the entire wafer into a concentrate. This concentrate is then dried on a silicon or non-silicon substrate and placed into the TXRF for analysis. This concentrated sample will allow the TXRF to see much lower levels of contamination, as low as 10E7. By using a proprietary non-silicon substrate and our sealed Cr tube even light element detection becomes reliable at the low levels required for today's memory manufacturing.

The TREX 630i is designed for production. Standard design features such as multiple scan nozzle, dual cleaning stations, bulk chemical feeds, separate dry and decomposition stations, ICP-MS load station, windows-style user interface, advanced automation and optional GEM/SECS make this tool a strong option for satisfying the bulk of the demand for in-fab samples currently being sent to the lab for ICP-MS analysis. The 630i doesn't take a vacation, or hesitate to work third shift, making it the obvious choice to supplement the more labor intense techniques in use today.

The TREX 630i's versatile design allow the sample preparation technique to operate independently of the TXRF. This feature allow greater tool utilization and offers a lower CoO to our customers.

 


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